Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11804462 | Hybrid bonding structures and semiconductor devices including the same | Junghoon Lee, Byonggwon Song | 2023-10-31 |
KC
Kunmo Chu
Overall (2023): #360,690 of 537,848Top 70%
1
Patents 2023