Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11667786 | Encapsulating or filling composition for electronic devices and electronic apparatus | Wonmin Yun, Yohan Kim, Byoungduk Lee, Yunah Chung, Yoonhyeung Cho +2 more | 2023-06-06 |