Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11581261 | Chip on film package | Chun-Yu Liao, Teng-Jui Yu, Jr-Ching Lin, Wen-Ching Huang | 2023-02-14 |
| 11569162 | Chip on film package with reinforcing sheet and manufacturing method of chip on film package with reinforcing sheet | Chiao-Ling Huang | 2023-01-31 |