Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11830810 | Packaged transistor having die attach materials with channels and process of implementing the same | Mitch Flowers, Erwin B. Cohen, Alexander Komposch | 2023-11-28 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11830810 | Packaged transistor having die attach materials with channels and process of implementing the same | Mitch Flowers, Erwin B. Cohen, Alexander Komposch | 2023-11-28 |