Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11715928 | Decoupling layer to reduce underfill stress in semiconductor devices | Susheel Jadhav, Ankur Agrawal, Quan Tran, Raiyomand Aspandiar, Kenneth M. Brown | 2023-08-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11715928 | Decoupling layer to reduce underfill stress in semiconductor devices | Susheel Jadhav, Ankur Agrawal, Quan Tran, Raiyomand Aspandiar, Kenneth M. Brown | 2023-08-01 |