Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11824002 | Variable pitch and stack height for high performance interconnects | En-Shao Liu, Chen-Guan Lee, Walid M. Hafez, Chia-Hong Jan, Jiansheng Xu | 2023-11-21 |
| 11695008 | Methods of integrating multiple gate dielectric transistors on a tri-gate (FINFET) process | Curtis Tsai, Chia-Hong Jan, Jeng-Ya David Yeh, Walid M. Hafez | 2023-07-04 |
| 11610917 | High voltage three-dimensional devices having dielectric liners | Walid M. Hafez, Jeng-Ya David Yeh, Curtis Tsai, Chia-Hong Jan, Gopinath Bhimarasetti | 2023-03-21 |