Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11812549 | Package device and manufacturing method thereof | Cheng-En Cheng, Yu-Ting Liu | 2023-11-07 |
| 11798853 | Manufacturing method of package device | Kuang-Chiang HUANG, Yu-Ting Liu, Yi-Hung Lin, Cheng-En Cheng | 2023-10-24 |
| 11789066 | Method for manufacturing electronic device having a seed layer on a substrate | — | 2023-10-17 |
| 11776914 | Package device | Cheng-En Cheng, Yu-Ting Liu | 2023-10-03 |
| 11769685 | Manufacturing method of semiconductor package | Cheng-Chi Wang, Wen-Hsiang Liao, Hung-Sheng Chou, Cheng-En Cheng | 2023-09-26 |
| 11694999 | Electronic device and fabrication method thereof | — | 2023-07-04 |
| 11582865 | Package device | Cheng-En Cheng, Yu-Ting Liu | 2023-02-14 |
| 11551970 | Method for manufacturing an electronic device | Cheng-Chi Wang, Cheng-En Cheng | 2023-01-10 |