Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11640362 | Procedures for improving efficiency of an interconnect fabric on a system on chip | Shailendra Desai, Juan Sierra, Parimal Gaikwad, Amit Jain, Mark Pearce | 2023-05-02 |
RT
Robert Totte
Overall (2023): #274,885 of 537,848Top 55%
1
Patents 2023