Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837585 | Wafer level packaging of light emitting diodes (LEDs) | Michael John Bergmann, David T. Emerson, Christopher P. Hussell | 2023-12-05 |
| 11776938 | High density pixelated LED and devices and methods thereof | John Edmond, Matthew Donofrio, Jesse Colin Reiherzer, Peter Scott Andrews, Kevin Haberern | 2023-10-03 |