Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11798885 | Method of fabricating copper pillar bump structure with solder supporting barrier | Ling-Yi Chuang | 2023-10-24 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11798885 | Method of fabricating copper pillar bump structure with solder supporting barrier | Ling-Yi Chuang | 2023-10-24 |