Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11646248 | Semiconductor device having a lead flank and method of manufacturing a semiconductor device having a lead flank | Kwang Seok Oh, George Scott | 2023-05-09 |
| 11569163 | Method for fabricating semiconductor package and semiconductor package using the same | Seung Woo Lee, Byong Jin Kim, Sang Goo Kang | 2023-01-31 |