Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784296 | Semiconductor device package and a method of manufacturing the same | Mei-Yi Wu, Lu-Ming Lai, Yung-Yi Chang | 2023-10-10 |
| 11569179 | Package structure including an outer lead portion and an inner lead portion and method for manufacturing package structure | — | 2023-01-31 |