Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11856856 | Thermal conduction unit, electronic module and heat dissipating device | — | 2023-12-26 |
| 11791227 | Electronic device package | Kuoching CHENG, Yuan-Feng Chiang, Ya Fang Chan, Shih-Yu Wang | 2023-10-17 |
| 11721645 | Semiconductor package device and semiconductor process | — | 2023-08-08 |
| 11721652 | Semiconductor device package and method of manufacturing the same | — | 2023-08-08 |
| 11699682 | Semiconductor device package and method of manufacturing the same | — | 2023-07-11 |
| 11694984 | Package structure including pillars and method for manufacturing the same | — | 2023-07-04 |