Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11830834 | Semiconductor device, semiconductor device package and method of manufacturing the same | Chih-Cheng Lee | 2023-11-28 |
| 11721678 | Semiconductor device package including stress buffering layer | Chien-Mei Huang, Shih-Yu Wang, I-Ting Lin, Wen-Hung Huang, Yuh-Shan Su +1 more | 2023-08-08 |
| 11715694 | Embedded component package structure having a magnetically permeable layer | Chih-Cheng Lee | 2023-08-01 |