Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11457529 | Circuit board, apparatus and method for forming via hole structure | Yingxin Wang, Bi YI, Huazhang CAO | 2022-09-27 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11457529 | Circuit board, apparatus and method for forming via hole structure | Yingxin Wang, Bi YI, Huazhang CAO | 2022-09-27 |