Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11463063 | Method for packaging an electronic component in a package with an organic back end | Dror Hurwitz, BawChing Perng | 2022-10-04 |
| 11245383 | Packages with organic back ends for electronic components | Dror Hurwitz, BawChing Perng | 2022-02-08 |