Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11476173 | Manufacturing method of integrated circuit packaging structure | Houde Zhou, Baohua Zhang, Chao Gu | 2022-10-18 |
| 11469153 | Electronic component comprising substrate with thermal indicator | Houde Zhou, Chao Gu | 2022-10-11 |
| 11462741 | Metallic lithium-skeleton carbon composite material having a hydrophobic cladding layer, preparation method and use thereof | Tuo Kang, Liwei Chen, Wei Lu, Yanbin Shen, Yalong WANG +2 more | 2022-10-04 |
| 11339849 | Three-dimensional isolator with adaptive stiffness property | Ying Zhou | 2022-05-24 |
| 11232969 | Method and device for wafer taping | Mingliang Li, Jian Miao | 2022-01-25 |