Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11529700 | Systems and methods for laser dicing of bonded structures | Xianbin Wang, Yongwei Li | 2022-12-20 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11529700 | Systems and methods for laser dicing of bonded structures | Xianbin Wang, Yongwei Li | 2022-12-20 |