Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488931 | Encapsulated fan-in semiconductor package with heat spreader and method of manufacturing the same | Minghao Shen | 2022-11-01 |
| 11274234 | Adhesive composition for temporary bonding of semiconductor workpiece and support carrier pair | Chunbin Zhang, Minghao Shen, Yijiang Hu, Shaolin Zou | 2022-03-15 |