Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11227818 | Stacked dies electrically connected to a package substrate by lead terminals | Wing Keung Lam, Saravuth Sirinorakul, Kok Chuen Lock | 2022-01-18 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11227818 | Stacked dies electrically connected to a package substrate by lead terminals | Wing Keung Lam, Saravuth Sirinorakul, Kok Chuen Lock | 2022-01-18 |