Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11267201 | Increased material flow throughput in large scale additive manufacturing through movable segmented build platform | Vlastimil Kunc, Ahmed A. Hassen, Brian K. Post, John M. Lindahl, Lonnie J. Love +3 more | 2022-03-08 |