Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11349221 | Dielectric structure applied to building components for increasing transmittance of RF signal and disposing method thereof | Hsien-Chiung Fu, Ming Lu | 2022-05-31 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11349221 | Dielectric structure applied to building components for increasing transmittance of RF signal and disposing method thereof | Hsien-Chiung Fu, Ming Lu | 2022-05-31 |