Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11342184 | Method of forming multiple patterned layers on wafer and exposure apparatus thereof | BUM-HWAN JEON, Siwon Yang, Kihyung Lee, BYUNG-IN KWON | 2022-05-24 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11342184 | Method of forming multiple patterned layers on wafer and exposure apparatus thereof | BUM-HWAN JEON, Siwon Yang, Kihyung Lee, BYUNG-IN KWON | 2022-05-24 |