Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11222785 | Method for depositing a metal layer on a wafer | Jianhua Chen, Haipeng Zhu, Xianlei Zhang, Min Chen, Ching-Ning Yang +1 more | 2022-01-11 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11222785 | Method for depositing a metal layer on a wafer | Jianhua Chen, Haipeng Zhu, Xianlei Zhang, Min Chen, Ching-Ning Yang +1 more | 2022-01-11 |