Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11476212 | Semiconductor contact structure having stress buffer layer formed between under bump metal layer and copper pillar | — | 2022-10-18 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11476212 | Semiconductor contact structure having stress buffer layer formed between under bump metal layer and copper pillar | — | 2022-10-18 |