Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11322438 | Package structure and manufacturing method thereof | Hsin-Hung Chou, Chun-Hung Lin | 2022-05-03 |
| 11309267 | Semiconductor device including uneven contact in passivation layer and method of manufacturing the same | Jin-Neng Wu | 2022-04-19 |