Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11347342 | Conductive bonding structure for substrates and display device including the same | Seong-Sik Park, Gyutae Kim, Sung-Soo Lee | 2022-05-31 |
| 11289385 | Semiconductor die and a method for detecting an edge crack in a semiconductor die | — | 2022-03-29 |