Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521895 | Semiconductor device | Da-Jun Lin, Bin-Siang Tsai | 2022-12-06 |
| 11373901 | Interconnection structure and method of forming the same | Yu-Cheng Lin, Bin-Siang Tsai | 2022-06-28 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521895 | Semiconductor device | Da-Jun Lin, Bin-Siang Tsai | 2022-12-06 |
| 11373901 | Interconnection structure and method of forming the same | Yu-Cheng Lin, Bin-Siang Tsai | 2022-06-28 |