Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11408720 | Device and method for measuring thickness of dielectric layer in circuit board | Cheng-Jui Chang, Jeng-Wey Chiang | 2022-08-09 |
| 11408799 | Device and method for measuring thickness of dielectric layer in circuit board | Cheng-Jui Chang | 2022-08-09 |
| 11266034 | Interface system for functional module and functional module thereof | Hsiao-Hui Lee | 2022-03-01 |