Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11348869 | Method of manufacturing chip packaging structure | Chun-Hsien Chien, Wen-Liang Yeh, Wei-Ti Lin | 2022-05-31 |
| 11251350 | Light-emitting diode package and manufacturing method thereof | Yi-Cheng Lin, Yu-Hua Chen, Chun-Hsien Chien, Cheng-Hui Wu | 2022-02-15 |