Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11277909 | Three-dimensional circuit assembly with composite bonded encapsulation | John Vesce, III | 2022-03-15 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11277909 | Three-dimensional circuit assembly with composite bonded encapsulation | John Vesce, III | 2022-03-15 |