Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11497112 | Driver board assemblies and methods of forming a driver board assembly | Feng Zhou, Hiroshi Ukegawa | 2022-11-08 |
| 11388839 | Power electronics cooling assemblies and methods for making the same | Feng Zhou | 2022-07-12 |
| 11328980 | Automotive power devices on direct bond copper embedded in PCB driver boards | Feng Zhou | 2022-05-10 |