Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11319457 | Support-provided insulating layer, laminate, and wiring board | Konatsu Nakamura, Shin Takanezawa | 2022-05-03 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11319457 | Support-provided insulating layer, laminate, and wiring board | Konatsu Nakamura, Shin Takanezawa | 2022-05-03 |