Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11261539 | Method for manufacturing reformed sic wafer, epitaxial layer-attached sic wafer, method for manufacturing same, and surface treatment method | Yusuke Sudo, Masato Shinohara, Youji Teramoto, Takuya Sakaguchi, Satoru Nogami +1 more | 2022-03-01 |