Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11433474 | Ultrasonic bonding method | Hiroshi Kobayashi, Yoshihito Yamada | 2022-09-06 |
| 11249008 | Peeling and grasping apparatus, peeling inspection apparatus, and ultrasonic vibration bonding system | Yoshihito Yamada | 2022-02-15 |
| 11214017 | Ultrasonic vibration welding apparatus | Yoshihito Yamada | 2022-01-04 |