Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11334360 | High throughput disassembly system for executable code and applications | Xunchao Hu, Sheng Yu | 2022-05-17 |
HY
Heng Yin
Overall (2022): #434,593 of 548,613Top 80%
1
Patents 2022