Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11394184 | Method for forming a wire bundle and coupling the wire bundle to a structure background | Robert Johnson, Jin-Seog Seo, Jacky-Vy C. Chau | 2022-07-19 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11394184 | Method for forming a wire bundle and coupling the wire bundle to a structure background | Robert Johnson, Jin-Seog Seo, Jacky-Vy C. Chau | 2022-07-19 |