Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11281096 | Methods of making a bonded assembly and a re-entrant structure, and method of transfer printing a masking layer | Hohyun Keum, Jun Kyu Park | 2022-03-22 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11281096 | Methods of making a bonded assembly and a re-entrant structure, and method of transfer printing a masking layer | Hohyun Keum, Jun Kyu Park | 2022-03-22 |