Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11430720 | Recess lead for a surface mount package | Naweed Anjum, Michael G. Amaro | 2022-08-30 |
| 11259209 | System and method for dynamically switching transmission of data from cellular to unidirectional point-to-multipoint network | Parag Naik, Arindam Chakraborty, Anindya Saha, Vishwakumara Kayargadde, Mark A. AITKEN | 2022-02-22 |
| 11217460 | Multiple underfills for flip chip packages | Tae Hee Kim | 2022-01-04 |