Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515266 | Methods and apparatus for scribe street probe pads with reduced die chipping during wafer dicing | Ricky Alan Jackson, Sudtida Lavangkul | 2022-11-29 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515266 | Methods and apparatus for scribe street probe pads with reduced die chipping during wafer dicing | Ricky Alan Jackson, Sudtida Lavangkul | 2022-11-29 |