Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11302652 | Semiconductor package substrate with a smooth groove about a perimeter of a semiconductor die | Bob Lee, YuhHarng Chien | 2022-04-12 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11302652 | Semiconductor package substrate with a smooth groove about a perimeter of a semiconductor die | Bob Lee, YuhHarng Chien | 2022-04-12 |