Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11348806 | Making a flat no-lead package with exposed electroplated side lead surfaces | Lee Han Meng@ Eugene Lee, Shu Hui Ooi, Wei Fen Sueann Lim | 2022-05-31 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11348806 | Making a flat no-lead package with exposed electroplated side lead surfaces | Lee Han Meng@ Eugene Lee, Shu Hui Ooi, Wei Fen Sueann Lim | 2022-05-31 |