Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11385258 | Encapsulated component attachment technique using a UV-cure conductive adhesive | Julie A. Campbell, Regina R. Mrozik | 2022-07-12 |
| D947693 | Measurement probe head assembly | David Thomas Engquist, Heather J. Vermilyea, Michael J. Mende, Tony Lee Tarr | 2022-04-05 |