Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11239639 | Assembly and method for sealing a bundle of wires | Vijay Daga, Jaydip Das, Kavitha Bharadwaj, Ting Gao, Quentin F. Polosky | 2022-02-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11239639 | Assembly and method for sealing a bundle of wires | Vijay Daga, Jaydip Das, Kavitha Bharadwaj, Ting Gao, Quentin F. Polosky | 2022-02-01 |