Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11283208 | 3D printed high resolution electrical connectors with novel material removal features | Xiaoming Luo, Hailing Liu, Thierry Marin-Martinod, Matt Mcalonis, Mark Ostasiuk +1 more | 2022-03-22 |
| 11264749 | Modular connector with printed circuit board wafer to reduce crosstalk | Keith Edwin Miller, Albert Tsang, Scott Eric Walton, Eric Douglas Springston, II | 2022-03-01 |