Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11267071 | Ultrasonic bonding head, ultrasonic bonding device, and ultrasonic bonding method | Seijiro SUNAGA, Toshinobu Miyagoshi | 2022-03-08 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11267071 | Ultrasonic bonding head, ultrasonic bonding device, and ultrasonic bonding method | Seijiro SUNAGA, Toshinobu Miyagoshi | 2022-03-08 |