Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11445605 | Printed wiring board, multilayer printed wiring board and method for manufacturing printed wiring board | Seiko KOMATSU, Seiichi Tajima, Wakiko SATO | 2022-09-13 |
| 11412621 | Device-embedded board and method of manufacturing the same | Seiichi Tajima, Takashi Kariya | 2022-08-09 |
| 11382218 | Printed wiring board and method for manufacturing the same | Seiichi Tajima, Takashi Kariya | 2022-07-05 |
| 11335614 | Electric component embedded structure | Kenichi Yoshida, Mitsuhiro Tomikawa | 2022-05-17 |