Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11510349 | Shield package and method of manufacturing shield package | Hidetoshi Noguchi, Hajime Nakazono | 2022-11-22 |
| 11414554 | Conductive coating material and production method for shielded package using conductive coating material | Kazuhiro Matsuda, Ken Yukawa | 2022-08-16 |
| 11370926 | Conductive coating material and production method for shielded package using conductive coating material | Kazuhiro Matsuda, Ken Yukawa | 2022-06-28 |
| 11236227 | Heat dissipation material adhering composition, heat dissipation material having adhesive, inlay substrate, and method for manufacturing same | Kazuhiro Matsuda, Ken Yukawa | 2022-02-01 |