Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11505857 | High strength/highly conductive copper alloy plate material and manufacturing method therefor | Yusuke Saito, Sigeyuki Nakano | 2022-11-22 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11505857 | High strength/highly conductive copper alloy plate material and manufacturing method therefor | Yusuke Saito, Sigeyuki Nakano | 2022-11-22 |