Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11456271 | Noble metal-coated silver wire for ball bonding and method for producing the same, and semiconductor device using noble metal-coated silver wire for ball bonding and method for producing the same | Jun Chiba, Shota Kawano | 2022-09-27 |
| 11289442 | Gold-coated silver bonding wire and manufacturing method thereof, and semiconductor device and manufacturing method thereof | Shota Kawano, Yusuke SAKITA | 2022-03-29 |
| 11251153 | Noble metal-coated silver wire for ball bonding, and semiconductor device using noble metal-coated silver wire for ball bonding | Jun Chiba, Shota Kawano | 2022-02-15 |